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<p>[QUOTE="nesvt, post: 32442, member: 1749"]I wouldn't be suprised if something like that develops soon. I'm a software developer, but I focus mostly on business applications. I know someone that concentrates on scientific imaging software. His group developed something for the semi-conductor manufacturing industry. They take a scan of a wafer (round flat silicon wafer with many chips that have not yet been diced) and feed it through the software. It analyzes points on the object and also takes an overall analysis. If a mark is detected that shouldn't be there, they check everything around it to see how big it is, how deep, how long, raised or dented, etc. They compare the results with a database of prior images. They can narrow down the type of defect, how it was caused, and what machine it came from. It might not sound like much (especially with my poor explanation), but it saves millions of dollars. They can tell that machine #1187B, in production line ABC, in the 4,648th step of manufacturing.... has a piece of dust on a certain part.</p><p>The same exact concept could be used to identify Morgan and Peace VAMs. It could probably also be used to grade coins.[/QUOTE]</p><p><br /></p>
[QUOTE="nesvt, post: 32442, member: 1749"]I wouldn't be suprised if something like that develops soon. I'm a software developer, but I focus mostly on business applications. I know someone that concentrates on scientific imaging software. His group developed something for the semi-conductor manufacturing industry. They take a scan of a wafer (round flat silicon wafer with many chips that have not yet been diced) and feed it through the software. It analyzes points on the object and also takes an overall analysis. If a mark is detected that shouldn't be there, they check everything around it to see how big it is, how deep, how long, raised or dented, etc. They compare the results with a database of prior images. They can narrow down the type of defect, how it was caused, and what machine it came from. It might not sound like much (especially with my poor explanation), but it saves millions of dollars. They can tell that machine #1187B, in production line ABC, in the 4,648th step of manufacturing.... has a piece of dust on a certain part. The same exact concept could be used to identify Morgan and Peace VAMs. It could probably also be used to grade coins.[/QUOTE]
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