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<p>[QUOTE=&quot;Clawcoins, post: 3425337, member: 77814&quot;]to add to that ... plating blisters occur from three main possible causes:</p><p>1 - preparation / contamination</p><p>2 - oxidation</p><p>3 - plating rate</p><p><br /></p><p>You can bet the farm that #3 they are plating &quot;as fast as possible&quot; to keep total production costs down.</p><p><br /></p><p>The solution temperature and electrical current has direct impact on the End Quality.&nbsp; By increasing the electrical current&nbsp; you can increase the production rate.&nbsp; Although the resultant could be uneven and incomplete bonding of the copper on the zinc (such as what you are seeing).&nbsp; Which when your primary concern is *fast*,&nbsp; the 100% quality isn&#039;t really deemed a concern especially for coins being used in the money supply (non collectable quality)[/QUOTE]</p><p><br /></p>

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