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<p>[QUOTE=&quot;Pete Apple, post: 26132448, member: 103982&quot;]<b>I have been researching plating issues on Copper Plated Zinc Cents. The information I have found has been both interesting and challenging. My research has resulted in some papers I prepared to organize the information in a way that I can understand. </b></p><p><br /></p><p><b>Unfortunately, I have only scratched the surface! It seems that I continue to find significant related aspects that I may yet include in future revisions. </b></p><p><br /></p><p><b>I am sharing one of those papers here in .pdf format.</b></p><p><b><br /></b></p><p><b><b>SUMMARY</b></b></p><p><b><br /></b></p><p><b><b>Since copper is a Nanocrystalline (NC) metal, it has a face-centered cubic crystal structure that is prone to exhibit plastic deformation. During plating, stress gradients are formed within the plating and may be amplified by various elements of the plating process. As the crystalline lattice structure of the plating reorients to release the stress, ridges and valleys are created by the grains rotating out of plane.</b></b></p><p><b><br /></b></p><p><b>&nbsp;[ATTACH=full]1667751[/ATTACH]</b></p><p><b></b>[/QUOTE]</p><p><br /></p>

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