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<p>[QUOTE="Clutchy, post: 1660947, member: 45040"]I dont see any obvious solder work. Everything looks to be in the right spots as well. The only issues I have is the chip in the S, the halo around the S and date and the toning difference on the reverse right behind the date and S. I am not a coin expert so obviously these are just my scenarios and my thoughts of what could happen.</p><p><br /></p><p>1. The coin was cleaned with some type of brushing action around the date and mintmark and the toning on the reverse, right behind the date/S, was dirt removed at some point. (This is probably the case)</p><p>OR</p><p>2. The issue with soldering something this small would be solder flow. It would be almost impossible to keep solder from accumulating in the open areas of the S, which would have to be removed but there would be obvious work done. A chip in the S would fill this area, leaving a wider area for a surface to be soldered and eliminate the need to clean. Solder only on the upper half of the S would be strong enough to bond the S to the coin. The heat would be applied to the backside of the coin, bonding the S to the coin. The flame would burn off any toning in that area and the date and mintmark itself would act like a heat sink, drawing heat from the coin, causing a halo effect around the heat sinks.</p><p><br /></p><p>Dusty, Im not saying your coin is fake, just pointing out scenarios that could be happening. The only way to make sure is to certify the coin.[/QUOTE]</p><p><br /></p>
[QUOTE="Clutchy, post: 1660947, member: 45040"]I dont see any obvious solder work. Everything looks to be in the right spots as well. The only issues I have is the chip in the S, the halo around the S and date and the toning difference on the reverse right behind the date and S. I am not a coin expert so obviously these are just my scenarios and my thoughts of what could happen. 1. The coin was cleaned with some type of brushing action around the date and mintmark and the toning on the reverse, right behind the date/S, was dirt removed at some point. (This is probably the case) OR 2. The issue with soldering something this small would be solder flow. It would be almost impossible to keep solder from accumulating in the open areas of the S, which would have to be removed but there would be obvious work done. A chip in the S would fill this area, leaving a wider area for a surface to be soldered and eliminate the need to clean. Solder only on the upper half of the S would be strong enough to bond the S to the coin. The heat would be applied to the backside of the coin, bonding the S to the coin. The flame would burn off any toning in that area and the date and mintmark itself would act like a heat sink, drawing heat from the coin, causing a halo effect around the heat sinks. Dusty, Im not saying your coin is fake, just pointing out scenarios that could be happening. The only way to make sure is to certify the coin.[/QUOTE]
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