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<p>[QUOTE=&quot;rmpsrpms, post: 2667209, member: 31773&quot;]My degree is in Electronic Engineering, and I&#039;ve spent most of my career building Power Amplifiers for cell phones. The cell phone you use today probably (90% probability) contains Power Amplifiers and other components that use both device and packaging technologies I helped to develop. I&#039;m currently working for an RF MEMS company. As you might imagine, MEMS takes the concepts of &quot;mechanical&quot; and &quot;machine&quot; to a whole new nano-level. </p><p><br /></p><p>One of my responsibilities (I work for a startup, so I wear many hats) is the reliability qualification of the MEMS devices. These qualifications have many aspects, but most relevant to this discussion is the package/mechanical qualification. We qualify the <b>mechanical characteristics</b> of the MEMS package under many conditions: vibration; shock; acceleration; thermal; moisture; aging; dimensional; etc.[/QUOTE]</p><p><br /></p>

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