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<p>[QUOTE=&quot;Colonialjohn, post: 3041390, member: 57741&quot;]Once Material Analysis becomes more commonplace this will be an easier task. There is no way to catch these once they enter the market QUICKLY. I expect the edges to look new, very low sulfur and chlorides on the surface and who knows what other 21st Century impurities will be traced in the copper alloy. These raised bumps are signatures for a die cast transfer process.</p><p><br /></p><p>I ssume you were not at the EAC Meeting in Baltimore? JPL[/QUOTE]</p><p><br /></p>

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