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<p>[QUOTE=&quot;Kevin Mader, post: 25313154, member: 106826&quot;]Tip: one way to determine if there is machine damage, view the device at a “higher” level. Trace the periphery of a device. Is the area of interest thicker? Thinner? Thickness might suggest doubling. Thinning suggests deterioration or machine damage. What happens often is the device has distortion caused by one or the other, or both. That’s what I see in your specimen.&nbsp; Evidence of die wash and the shelflike appearance in the ‘thinner’ section of the device.&nbsp; </p><p><br /></p><p>Thicker devices could be from actual doubling. But later die stages produce devices that spread out and become distorted.&nbsp; True doubling can be confirmed by offsets/rotation. These are not present here though.[/QUOTE]</p><p><br /></p>

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