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<p>[QUOTE=&quot;Kevin Mader, post: 24672500, member: 106826&quot;]A good place to start is with the process. The process to make a planchet and the process to coin a coin. </p><p><br /></p><p>planchet - copper plating is generally homogeneous. But surface prep of the zinc substrate can influence the bond. Residue can adversely impact this ( e.g., oil, dirt, debris). </p><p><br /></p><p>coining - this process displaces material and in areas with more detail and sharp edges, the copper may become significantly thinner/stretched and more prone to cracks, splits and breaks. </p><p><br /></p><p>Looking at your specimen, there may have been bonding problems further exacerbated by the coining process.&nbsp; This was further exacerbated by circulation, exposure, and aging.[/QUOTE]</p><p><br /></p>

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