The copper layer will degrade as soon as it's exposed to a harsh environment, and eventually let the catalyst to the Cu-Zn interface. One inhibitor (I prefer "retardant") is a thicker copper layer. Another is the fact that the number of "harsh environment exposure minutes" a new cent is subjected to today within 6 months of being struck is lower than it was in 1987 (i.e., they don't circulate as vigorously).
CoinCorgi are you part of the United States mint? I would like to hear your side also. All I have seen is you discrediting others but no insight from you.
I asked them to provide sources for their "facts".That is not discrediting anything or anybody. If Thad is a well known and respected source (which I have no idea if that is so or not), then say so and then that alone gives his statement of fact some credibility. WTF did I do wrong in asking for some "source" of this information. Jeez. It's as if no one has ever asked for "Do you have a link?" on this forum. Crikey.
I work in the metalworking fluid industry (20 years now) as Senior Analytical Chemist. I work with the same suppliers the Mint does. While I cannot and will not reveal the inhibitors used by the mint, I know they use them and what they are through many technical meetings with suppliers (I am the supplier/raw material coordinator at my company). After 20 years in the metalworking, metal protection and cleaning industry, I do know a little about the subject.
Neat. Can you, without violating any nda's etc., answer any other of my previous questions in post #25? TIA. Not playing gotcha btw.
If you're a collecting old timer, chances are you've bought one of BadThad's formulae in a commercial product.